Siemens Eletric System Wire Cutting Machine for Large-Scale Wire Production

Product Description:

The Multi Wire Saw Machine is a cutting-edge Wire Cutting Machine designed for cutting Silicon Wafers with precision and efficiency. With a Stone Lifting Type as the Lifting Method, this machine is equipped to handle the demands of cutting materials with a Processing Thickness ranging from 5mm to 30mm.

One of the key features of this Wire Cutting Machine is its ultra-thin Wire Thickness of 0.55mm. This ensures that the cuts made by the machine are clean and accurate, meeting the high standards required in the semiconductor industry.

The Multi Wire Saw Machine is a powerful tool with a Total Power of 300kw, allowing it to efficiently cut through Silicon Wafers with ease. Its robust construction and advanced technology make it a reliable choice for businesses looking to enhance their cutting processes.

Whether you are in the electronics industry or semiconductor manufacturing, this Wire Cutting Machine offers a versatile solution for your cutting needs. Its precision cutting capabilities make it ideal for creating wafers of various sizes and shapes, meeting the specific requirements of your production processes.

With the Multi Wire Saw Machine, you can expect consistent and high-quality results, thanks to its advanced features and reliable performance. This machine is designed to streamline the cutting process, saving you time and resources while ensuring top-notch precision in every cut.

Investing in the Multi Wire Saw Machine is a smart choice for businesses looking to optimize their cutting operations. Its efficiency, accuracy, and durability make it a valuable asset for any manufacturing facility or production line.

Experience the power and precision of the Multi Wire Saw Machine and take your cutting capabilities to the next level. Upgrade to this state-of-the-art Wire Cutting Machine and unlock new possibilities for your business.

Technical Parameters:

Applications:

The Multi Wire Saw Machine, manufactured by the OEM brand in China, is a high-performance wire cutting machine designed specifically for cutting silicon wafers. With a power consumption of 20kW, this advanced machine is suitable for various processing thicknesses ranging from 5mm to 30mm.

One of the key features of this Multiple Wire Saw Machine is its precise cutting ability, thanks to the ultra-thin wire thickness of 0.55mm. This allows for accurate cutting of silicon wafers with minimal material loss, making it a cost-effective solution for wafer production.

The dimensions of the Multi Wire Saw Machine are 5000*3000*2000mm, providing a compact yet sturdy structure for efficient operation. Its versatile usage makes it ideal for a wide range of applications in industries such as semiconductor manufacturing, solar panel production, and electronics.

The Multi Wire Saw Machine is perfect for cutting silicon wafers used in various electronic devices, including solar cells, integrated circuits, and sensors. Its high precision cutting capabilities make it a valuable asset for companies looking to enhance their production processes and achieve superior quality results.

Whether you are a semiconductor manufacturer, solar panel producer, or electronics company, the Multi Wire Saw Machine offers a reliable and efficient solution for your cutting needs. Invest in this cutting-edge technology to streamline your production processes and stay ahead of the competition.

Customization:

Product Customization Services for the Multiple Wire Saw Machine product:

Brand Name: OEM

Place of Origin: China

Model: MW-1000

Processing Thickness: 5-30mm

Usage: Cutting Silicon Wafers

Main Power: 60kw

Lifting Method: Stone Lifting Type

Support and Services:

The Multi Wire Saw Machine product offers comprehensive Product Technical Support and Services to ensure optimal performance and customer satisfaction. Our dedicated team of technical experts is available to assist with installation, troubleshooting, and maintenance of the equipment.

Our services include regular maintenance checks, on-site repairs, and access to a knowledge base for quick solutions to common issues. Additionally, we provide training programs to help operators maximize the efficiency and lifespan of the Multi Wire Saw Machine.

FAQ:

Q: What is the brand name of the Multi Wire Saw Machine?

A: The brand name of the Multi Wire Saw Machine is OEM.

Q: Where is the Multi Wire Saw Machine manufactured?

A: The Multi Wire Saw Machine is manufactured in China.

Q: What is the cutting capacity of the Multi Wire Saw Machine?

A: The cutting capacity of the Multi Wire Saw Machine varies depending on the model, ranging from X inches to Y inches.

Q: Does the Multi Wire Saw Machine come with a warranty?

A: Yes, the Multi Wire Saw Machine comes with a standard warranty. Please refer to the product documentation for more details.

Q: Can the Multi Wire Saw Machine be customized to meet specific requirements?

A: Yes, the Multi Wire Saw Machine can be customized to meet specific requirements. Contact our customer service for more information on customization options.